Selecting the correct technology depends on the required film quality and material. Physical Vapor Deposition (PVD), such as sputtering or e-beam evaporation, is ideal for metallic coatings and simple alloys where high purity is needed. Chemical Vapor Deposition (CVD) is preferred for complex geometries and high-conformality requirements, though it often requires higher temperatures. For atomic-level precision and thickness control, Atomic Layer Deposition (ALD) is the gold standard, especially in semiconductor and nanotechnology sectors.